Small-pitch LED displays have unique advantages and are highly sought after by the market. They can be said to enjoy all the glory. As a shield to protect it, LED packaging devices play a decisive role. Small-pitch LEDs are highly integrated, and the number of lamp beads per unit area has increased significantly, which also puts forward higher requirements for LED packaging. In this topic, "LED Screen Display World" specially invites relevant people from Hongqi Technology Co., Ltd., Mulinsen Co., Ltd., Foshan Guoxing Optoelectronics Co., Ltd., Shenzhen Jingtai Co., Ltd., Hangzhou Meikale Optoelectronics Co., Ltd. and other companies to discuss the secrets behind LED packaging.
1. The number of lamp beads per unit area of small-pitch LED displays has increased significantly, and the dead lamp rate has also increased. How can we further reduce the dead lamp rate of the display?
Hongqi Technology Company Spokesperson and Assistant Manager Zheng Jixiong:
Hongqi has currently shipped large quantities of small-pitch products. After more than a year of intensive revision, it is revised almost once a month. From plate design, material selection, process improvement, and the use of the advantages of Hongqi's own group, the affiliated company Jiuyuan Electronics (Jiuyuan is currently the world's largest chip testing and picking factory) assists. With its experience, it tailors screening procedures for all chips to achieve strict screening of chips; in addition, it also makes structural improvements and anti-fooling measures for die bonding and testing machines. Hongqi uses the above-mentioned countermeasures to provide Hongqi customers with cost-effective products in terms of quality and price. At present, the dead light rate reported by customers after use has reached below single digit ppm.
Mu Linsen General Manager Lin Jiliang:
As the density of lamp beads increases, the overall density of chips per square meter also increases. Therefore, to solve the problem of dead lamp rate, we must first improve the heat dissipation capacity of the corresponding system. Regarding this aspect, we at Mulinsen continue to enhance the heat dissipation and heat resistance of lamp beads. At the same time, in the context of relatively mature technology, we also continue to improve the corresponding materials and process standards, thereby minimizing the dead lamp rate.
Ouyang Xiaobo, General Manager of Nationstar Optoelectronics RGB Device Division:
The dead light rate depends on the reliability of the LED device. If you want to reduce the dead light rate of the display screen, you must start with the selection of raw materials for LED devices. This requires companies to pass strict management and control to achieve all-round quality clearance. In addition, through continuous innovation and improvement of LED device technology, the reliability of LED devices can be improved from the source and the dead light rate can be reduced. As a major domestic packaging company for small-pitch LED devices, Nationstar Optoelectronics has 46 years of gold medal quality assurance and a strong R&D team led by Ph.D. In the production of LED devices, we insist on selecting materials from high-quality suppliers and do not sacrifice quality to reduce costs. Strict process control, highly clean and professional dust-free workshops, high-precision production equipment, advanced production lines and strict shipment standard control are all the reasons why Nationstar Optoelectronics' small-pitch LED devices can ensure that the dead light rate is less than 10ppm. In the future, we will continue to increase our research and development efforts, continuously improve the reliability of devices, and bring better quality small-pitch LED devices to customers.
Dr. Shao Pengrui, Technical Director of Jingtai:
In the first generation of LED display products, almost all have defects with a relatively high dead light rate, ranging from dozens of PPM to hundreds of PPM. The reason lies in both product design defects and process control. In response to these reasons, our Jingtai Hummingbird series began research in the second half of last year, mainly through: 1. Redesigning and revising the structure and adopting our patented copper pillar via-hole CCVT technology, which completely solved the common industry problem of dead lamp leakage and failure due to design defects; 2. In terms of process control, more stringent process standards and inspections were adopted to ensure product stability; 3. In terms of material selection, special materials for small spacing were selected. Through three aspects, the on-machine failure rate of Hummingbird series products is less than 5ppm.
2. Nowadays, small-pitch products are very popular in the industry, which also puts forward higher requirements for packaging. How does your company respond?
Hongqi Technology Company Spokesperson and Assistant Manager Zheng Jixiong:
Small-pitch products are not as simple as they look on the outside. People say the devil is hidden in the details. Only by experiencing the baptism of large-scale shipments can we understand the secrets of each. Plate design, raw materials, processes, and equipment are all closely linked, and quality has always been the most important thing for Hongqi. For packaging, our company has strict standard processes to control the design before production, foolproofing during production, and inspection after production. To achieve the three-no policy of not accepting defective products, not manufacturing defective products, and not leaking defective products,
So small spacing is a product that Hongqi is quite confident about. The higher the requirements, the more we like them. We accept challenges and overcome them to satisfy customers.
Mu Linsen General Manager Lin Jiliang:
Since last year, we have been doing large-scale upgrades and rectifications on our equipment, from die bonding and wiring to glue dispensing, and even the entire equipment corresponding to light separation (spectroscopic color separation). Our company has completed all upgrades and renovations last year. Because the material volume of small-pitch products is smaller, their accuracy and density are relatively higher. Our company starts with the materials. We do everything from mold opening to design on the wire sweep frame (lead frame) and bracket, and we are relatively advanced in terms of technology. Therefore, from materials to equipment and even packaging processes, we are fully prepared in time to produce fine-pitch products with higher requirements.
ANNA