How much do you know about LED display GM packaging?

1. The simulated thermal resistance value is not the same as reliability. The GM (mSSOP) package complies with JEDEC JESD51 and JEDEC J-STD-020C standards

The simulated thermal resistance value is not related to reliability. The thermal resistance value shows that the package can carry power consumption and has nothing to do with reliability or cost. Taking the common SOT-23 package as an example, the simulated thermal resistance value is as high as 244°C/W, but its compact package is suitable for switch components. GM packaging is a micro-package specially created for the LED display industry by Macroblock Technology and professional packaging factories. All data fully complies with the internationally recognized JEDEC JESD51 and JEDEC J-STD-020C standards

2. Through experimental testing, the surface temperature of the GM (mSSOP) chip is close to that of GP (SSOP)

As the luminous efficiency of LEDs increases day by day, it is no longer necessary to use larger currents in exchange for brightness. The experimental results with an ambient temperature of 70°C and a burn-in time of 168 hours show that the MBI5120GM with integrated lamp driver and same surface part GM (mSSOP) package has a maximum chip surface temperature of 84°C when the driving current is equal to 18.6mA, and the converted junction temperature is 111.8°C, which is far lower than the upper limit of the die burnout temperature of 150°C and also lower than the recommended maximum safe operating temperature of 125°C. In the lamp driver separation design under the same conditions, using GP (SSOP) package MBI5024GP, the maximum chip surface temperature is 82°C, and the difference between the two is only 2°C. Therefore, choosing a smaller current and a higher luminous efficiency LED can not only achieve the same brightness, but also achieve energy-saving effects. At this time, reducing the package size will not only not affect the reliability performance, but also further realize the advantage of cost reduction.

3. GM (mSSOP) package realizes the integration of lamp driver and four major advantages to reduce costs and improve overall reliability

Taking the common P10/4 outdoor scanning screen as an example, after switching to GM packaging, the lamp driver can be integrated, and it has the following advantages: (1) saving the cost of the driver board, (2) saving the cost of pin headers, (3) saving the cost of solder joints, (4) reducing the production process and reducing labor costs. Since the integrated lamp driver design no longer uses joints, the reliability is actually improved compared to separate lamp driver designs using other packages.

4. GM (mSSOP) packaging has been successfully introduced into overseas European and American markets

Since GM packaging was promoted in 2013, in addition to successful cases established by major domestic module manufacturers and engineering companies, it has been successfully introduced into mass production. In overseas markets, Macroblock also has Daktronics of the United States, Mobitec of Europe, and other internationally renowned manufacturers gradually introducing mass production.

5. GM (mSSOP) packaging will be introduced into the entire product line

Macroblock Technology has always been a leader in the development of LED display driver chip technology, from the world's first S-PWM driver chip "MBI5030", the first S-PWM driver chip with built-in cache "MBI5050", to the first low-breakover voltage energy-saving driver chip "MBI5035". Pursuing continuous innovation, listening to customers' voices, and meeting customer needs are Juju Technology's consistent mission and self-challenge. While other competitors are still stuck in the 0.5um semiconductor process technology of 10 years ago, Macroblock Technology and Taiwan Semiconductor Semiconductor (TSMC), the world's largest foundry, have jointly upgraded the manufacturing process to 0.18um, so that all products can be introduced into GM (mSSOP) packaging.

Macroblock Technology actively invests in R&D to help customers create value

Macroblock Technology invests huge amounts of R&D expenses every year, which is unparalleled in the industry. The recent misunderstandings and descriptions of Macroblock's revolutionary GM (mSSOP) packaging on the Internet are not true. Macroblock Technology deeply regrets the untrue rumors on the Internet without verification. We regard our customers as our most important assets and it is our mission to assist our customers in creating value, which we hereby declare.