Leybold High-Tech applies for patents on LED packaging structure and packaging method

The patent summary shows that this application provides an LED packaging structure and packaging method. The LED packaging structure includes a first insulating layer; LED particles, the LED particles are arranged in the first insulating layer; and a touch sensing element, which is arranged in the first insulating layer to provide a touch sensing function. This application encapsulates touch sensing elements in the insulating layer that encapsulates LED particles, so that the LED packaging structure not only has a display function, but also has a touch sensing function. The touch sensing function can be realized without using an external touch panel, which can reduce the thickness of the overall display product and help to make the display product lighter and thinner.