MicroLED micro-display company Yanshan Technology completed Series A financing

Recently, West Lake Yanshan Technology (Hangzhou) Co., Ltd. (hereinafter referred to as "Yanshan Technology") announced the completion of Series A financing. This round of financing was led by Haiwang Capital, with participation from a number of market-oriented institutions such as Oriental Jiafu, Ivy Capital, and Jiupai Capital, with Chuang Ling Capital serving as a long-term financial advisor.

It is understood that the financing funds will be mainly used for product iteration of the 8-inch gallium nitride on silicon mass production line, solving the mass production bottleneck problem in the Micro LED industry and promoting the commercial delivery process. At the same time, the company will also increase investment in the research and development of next-generation high-performance products, further consolidate its technological advantages, and accelerate the dual-track industrial development of direct display and micro display.

Yanshan Technology focuses on the R&D and mass production of Micro LED display chips. It has core technologies such as MOCVD material growth, semiconductor thin film integration, hybrid bonding, and three-color vertical stacking. It is committed to developing semiconductor active light-emitting full-color Micro LED chips and modules. The company has been recognized as a national-level technology-based small and medium-sized enterprise.

In terms of technology research and development, Yanshan Technology adopts the all-gallium nitride vertical stacking technology route and masters core processes such as wafer-level three-color thin film integration, hybrid bonding and high-throughput epitaxial growth.

In the field of micro-display, the company provides AR glasses and micro-projection modules, and its customers include AVIC, BYD, Sunny, Goertek, Rokid and Thunderbird; in the field of direct display, the company mainly supplies chips, covering commercial displays, TVs, watches and transparent screens, with partners including Samsung, BOE, China Star and Tianma.

Looking back on the company's development history, in January 2025, Yanshan Technology signed a Micro LED chip project cooperation agreement with Deqing County, Huzhou, Zhejiang, focusing on the research and development of full-color AR/VR high-density chips. In July of the same year, the company completed Pre-A round financing of nearly 100 million yuan, jointly invested by Shenzhen Venture Capital, Ivy Capital, Moganshan Fund and Lenovo Venture Capital.

In September 2025, the company completed the entire Hybrid Bonding process on the 8-inch GaN-on-Si platform and successfully lit up the large-size Micro LED panel. This process increases the light extraction efficiency several times, significantly improves the processing yield, reduces the number of dead spots, reaches a connectivity rate of more than 6N, reduces the pixel pitch by more than three times, and the resolution exceeds 20,000 PPI.