MicroLED opens up a new “horizon” for large-screen displays

As the level of informatization and intelligence continues to improve, the demand for large-screen displays and ultra-high-definition displays continues to rise in various application scenarios such as command and dispatch centers, high-end conference rooms, digital billboards, and even home theaters. At the same time, users’ requirements for visual experience are also increasing day by day, which places higher demands on existing display technology.

However, in the face of growing market demand, existing display technologies such as LCD and OLED have their inherent bottlenecks gradually emerging when applied to the field of large-screen displays. In contrast, Micro LED technology, with its inorganic self-luminous properties, has shown significant advantages in improving display consistency, brightness and lifespan, and therefore has development potential in large-screen display applications.

Micro LED large-screen display products continue to emerge

Micro LED technology has the advantages of ultra-high display performance, unlimited splicing expansion and nearly zero-stitching design, which can well meet the market demand for large-screen displays. Micro LED is a key technology path to realize large-screen display. Through modular design, Micro LED The design effectively solves the technical bottlenecks of traditional displays in size expansion and seam control.

High-end large-screen display products on the market have already seen the application of Micro LED technology. For example, Samsung's The Wall series and Sony's Crystal LED series both bring stunning visual experiences with Micro LED technology. Domestic manufacturers such as Ledman Optoelectronics have also launched products such as the 163-inch 8K Micro LED ultra-high-definition home giant curtain wall, demonstrating the development potential of Micro LED technology in providing ultra-large display sizes and ultimate resolution.

Ledman Micro LED ultra-high-definition home giant screen (Photo source: Ledman Optoelectronics)

At recent important exhibitions such as CITE, InfoComm and Touch Taiwan, many manufacturers have demonstrated new products and technological progress of Micro LED splicing screens, reflecting the development trend and high attention of this technology in the industry.

In terms of ultra-high display performance, Micro LED chips have inherent advantages such as high brightness, high contrast, and wide color gamut, and can present extremely delicate, full-color, and lifelike picture details.

The 135-inch P0.7 TFT-based Micro LED splicing screen displayed by Chenxian Optoelectronics at InfoComm has a peak brightness of up to 1,500 nits, a contrast ratio of over 6,000:1, a pixel density of 1.64 million/㎡, and a color gamut covering more than 98% of DCI-P3. These parameters reflect the certain capabilities of Micro LED in display performance.

Chenxian Optoelectronics’ new generation 135-inch P0.7 TFT-based Micro-LED splicing screen (Photo source: Chenxian Optoelectronics)

Xida Electronics also released a 0.3mm pixel pitch Micro LED COB splicing display at InfoComm. This display breaks through the process limits of flip-chip COB and is the first to reach product-level levels.

For conference room scenarios, Absen exhibited the X series smart screens at InfoComm. This product uses Micro LED technology, has a 4K pixel matrix and UHD ultra-high definition resolution, and is equipped with Absen image processing algorithm to provide excellent display effects.

X series smart screen (Image source: Absen)

Regarding unlimited splicing expansion capabilities, the modular design of Micro LED gives the display system great flexibility and can be freely combined according to needs, easily breaking the inherent limitations of traditional display technology in physical size.

Innolux demonstrated a 204-inch 8K "color conversion Micro LED free splicing display module" wall at Touch Taiwan. The product uses AM drive and presents a pixel pitch of P0.5mm. It is equipped with an exclusive AI software and hardware integration solution, independently developed color conversion technology, COG mass transfer and repair technology, etc., and can be adapted to monitors from 25.4 to 204 inches.

In terms of zero-joint design, Micro LED can achieve seamless splicing by using high-precision manufacturing technology, thereby eliminating the black edge fragmentation common in traditional splicing screens and improving the coherence of the overall visual experience.

Chenxian Optoelectronics demonstrated the world’s thinnest TFT-based Micro LED box at the InfoComm exhibition. The thinnest part is less than 10 mm. The stitching is "0" micron. In addition, at the ICDT exhibition, Chenxian Optoelectronics and Visionox Innovation Institute jointly launched "Illusion InviLux", whose pixel spacing variation rate at the seams is less than 10%, effectively ensuring the continuity of the picture after multi-screen splicing.

Micro LED technology also has the ability to achieve transparent display effects. According to TrendForce's "2025 Global LED Display Market Outlook and Price and Cost Analysis", Micro LED transparent displays are quite suitable for use in retail department stores, art spaces (art galleries, museums, aquariums), restaurants and hotels, and other places to display products and assist in introductions.

In the field of automotive display, although Micro LED technology is not yet fully mature, manufacturers are still promoting the implementation of transparent screen applications. BHTC, an automotive display subsidiary of AUO, exhibited a smart cockpit display solution based on Micro LED at the CES show. Among them, the "Phantom Panoramic Canopy" seamlessly spliced ​​large-scale transparent Micro LED displays into the sunroof, bringing an immersive experience. At the same time, the skylight and side windows can be linked and support transparency adjustment.

“Panorama Panorama” (Image source: AUO)

AUO's partner Dahui International also demonstrated a new generation of Micro LED transparent display at CITE, which supports seamless splicing and expansion of multiple chips to meet the needs of ultra-large screen display applications.

The mass transfer of Micro LED is still a core difficulty, but the light is on the horizon

Although Micro LED has shown broad prospects in the large-screen display market and has received great attention from the entire industry, it still needs to overcome a series of technical and cost obstacles from the laboratory to large-scale industrialization. Among them, due to the extremely small size of Micro LED chips (usually less than 50 microns) and the need to achieve extremely high-density and precise integration on the substrate, it poses unprecedented challenges to the core manufacturing process - mass transfer technology. This is also one of the key bottlenecks currently restricting the large-scale application of Micro LED.

In order to overcome the core problem of mass transfer, the industry is actively exploring and innovating from multiple dimensions such as materials, equipment, processes, and architecture, striving to achieve technological breakthroughs and accelerate the industrialization process.

Department Branch companies choose to focus on improving or innovating the mass transfer process itself. For example, the new generation Hi-Micro technology released by Leyard uses a self-developed laser mass transfer process, which significantly improves transfer efficiency and system stability, and can meet the needs of complex application scenarios such as high-end displays.

Image source: Leyard

BOE continues to promote the internal development and verification of mass transfer technology by cooperating with internationally renowned equipment and materials companies and planning to build a 2.5-generation mass transfer pilot line.

In addition, further miniaturization of LED light-emitting chips is an effective way to reduce the cost of Micro LED and achieve higher PPI (pixel density), which also directly affects the required mass transfer technology route and substrate selection.

For micro-pitch displays below P1.0, the technology routes mainly explored by the industry include PCB substrate-based COB technology, glass-based AM/PM driven COG technology, and MiP new packaging routes. Focusing on these technical routes and different application requirements, many companies are conducting technical research from the packaging, substrate or backplane levels, and solving the corresponding massive transfer problems.

Packaging manufacturers such as Nationstar Optoelectronics, Hongli Zhihui, Ruifeng Optoelectronics, etc. are making efforts. Among them, Nationstar Optoelectronics has made progress in module integration based on AM drivers. Its self-developed 10-inch AM Micro LED full-color module has achieved It has achieved breakthroughs in mass transfer technology and accelerated its expansion into the commercial field of 4K/8K ultra-high definition.

In the field of MiP packaging technology, Leyard took the lead in strategic layout. The Hi-Micro product launched by the company uses a substrate-less Micro LED chip with a short side size of less than 30 μm, reflecting the latest progress in MiP technology.

Unilumin Technology simultaneously laid out the two major technical routes of MiP and COB, relying on vertically integrated industrial chain resources, investing in the construction of a semiconductor-grade MiP packaging and testing production line, achieving mass production of MiP 0202 lamp beads, and launching P0.4 pitch MiP display products.

Since Ledman Optoelectronics launched MiP technology pre-research in 2021, Micro-level MiP technology has matured and achieved small-volume trial production by 2024, and launched the first COB display product based on Micro-level MiP devices.

It is reported that Ledman Optoelectronics is actively exploring COB and glass-based technologies. The company has successively mastered COB formal packaging, flip-chip and other processes, and Together with upstream partners, we built a PM drive structure + glass substrate solution, conquered key technologies related to glass substrates such as massive through holes and thick copper, and solved some of the inherent defects of glass substrates. We are currently building a pilot base for exploration and upgrading.

For specific scenarios such as borderless splicing, Shentianma uses LTPS (low-temperature polysilicon) technology combined with GOA in pixel design to realize an ultra-narrow frame backplane of P0.15mm. Such solutions also put forward requirements for the high-precision mass transfer of Micro LED chips to complex LTPS backplanes, which Shentianma supports through technologies such as double-sided wiring and Cu processes.

In addition to process and substrate/packaging innovation, some companies are also seeking breakthroughs in chip architecture, performance, or system integration.

Innolux teamed up with American Micro LED company eLux to use color conversion technology to replace the traditional RGB chip layout. This simplifies the mass transfer and subsequent maintenance process by reducing the types and quantities of chips that need to be transferred, while improving display uniformity and helping to reduce production costs. cost and improve yield.

Chenxian Optoelectronics focuses on systematic technology integration and has achieved key technologies such as mass transfer, drive architecture, seamless splicing and hybrid bin. It has independently developed many innovative achievements such as high-speed mass transfer technology, glass-based TFT hybrid drive solution, TFT-based double-sided LTPS-TFT backplane process and hybrid assembly technology.

On the upstream chip side, by optimizing the light efficiency of Micro LED chips and improving the transfer yield, Fucai is laying a more solid foundation from the source for downstream manufacturers' massive transfer and final application.

As shown by the results achieved by these companies, by continuing to carry out technical research and explore diversified paths in multiple dimensions such as mass transfer process, chip design, material innovation, new packaging and system integration, the industry is gradually breaking through the core bottleneck of mass transfer and related problems, laying the foundation for the large-scale application and industrial development of Micro LED.

Micro LED industrialization process has accelerated significantly

Currently, Micro LED technology is accelerating the industrialization process at an unprecedented speed, and many companies have made important breakthroughs in building new production lines, increasing production capacity, and expanding market applications. It is worth noting that in the direction of large-screen display, panel manufacturers with the advantages of glass substrates are playing an increasingly critical role.

In promoting the industrialization of Micro LED, one of the main strategies is to build industrial advantages through deep binding or vertical integration with the upstream chip side. Through strategic holdings of BOE Huacan Optoelectronics and supporting Zhuhai Jingxin's downstream module projects, BOE has built BOE Huacan Optoelectronics' 6-inch Micro LED mass production line and Zhuhai Jingxin MLED module line. These two production lines will achieve mass production and product delivery in March 2025 respectively.

BOE Huacan Micro LED factory products are officially delivered (Photo source: BOE Huacan)

AU Optronics is working closely with its shareholder Fucai Holdings (which provides chips) and is building the world's highest-generation 4.5-generation Micro LED production line, which is planned to be put into mass production in 2025.

The other is to pool resources by establishing a specialized entity (a joint venture or a spin-off subsidiary) to efficiently promote the research and development and industrialization of Micro LED technology. TCL Huaxing and Sanan Optoelectronics jointly established Xinying Display, focusing on key technologies such as transfer bonding. Its Micro LED pilot line has been completed in October 2024 and is expected to be trial-produced in small batches in 2025; Visionox spun off and established Chenxian Optoelectronics, focusing on Micro LED technology based on TFT glass substrates, and successfully lit up the first TFT-based Micro LED in mainland China in December 2024. LED mass production line; Innolux Optoelectronics has established a subsidiary company, Qunchao Display Technology, focusing on Micro LED R&D and manufacturing. It is planning to put Micro LED products into production on the 3.5-generation LTPS production line first.

In addition, there are manufacturers such as Shentianma, which mainly rely on Relying on its advantages in existing panel technologies such as LTPS glass substrates and building corresponding production lines to accelerate application development, its G3.5 generation Micro LED production line with an investment of 1.1 billion yuan has successfully completed the entire process in December 2024, focusing on automotive, PID and other applications.

In addition to panel manufacturers, traditional LED packaging and application companies are also actively promoting the industrialization of Micro LED technology, especially making significant progress in increasing production capacity and expanding market applications.

The first phase of Leyard's self-developed new-generation high-end MIP production line with a full process has been officially put into production at Wuxi Lijing Factory on November 20, 2024. This production line focuses on the production of high-end MIP products using full flip-chip substrate-less Micro LED chips smaller than 50μm. The first phase production capacity reaches 1200KK/month, and the planned second phase will further expand to 2400KK/month.

Leyard's first full-process self-developed new generation high-end MIP production line (Photo source: Leyard)

At the market application level, Leyard's Micro LED technology has entered the stage of large-scale application. According to the company's disclosure on the investor interaction platform in March this year, in the field of large-screen commercial displays, the company's Micro LED orders have grown from zero to 1 billion yuan, and the application scope has also extended from the mid-to-high-end market to a wider range of fields.

Nationstar Optoelectronics recently disclosed in its 2024 annual report that its first batch of ultra-high-definition Mini & Micro LED projects in Geely Industrial Park achieved an increase in production capacity of more than 20%. This industrial park with a total investment of 2 billion yuan has been put into operation in 2024, focusing on the production of RGB small spacing, Mini/Micro LED, TOP/CHIP LED and other products, mainly used for ultra-high definition and new smart displays.

Summary

In summary, in the face of the growing demand for large-screen displays and ultra-high-definition displays, Micro LED technology is being widely regarded as an important development of the next generation of display technology with its excellent display performance, flexible splicing methods and seamless visual experience. direction. Although core technology and cost challenges such as massive transfers still exist, as this article shows, upstream and downstream companies in the industry chain are making every effort to accelerate technology maturity and mass production through huge R&D investments and active production line construction.

Market research data also confirms this development trend. According to the latest research from TrendForce, the output value of Micro LED chips is expected to reach approximately US$27.9 million in 2024, with the main source of contribution still being large displays. Looking to the future, the output value of Micro LED chips is expected to grow to US$740 million in 2029, with a compound growth rate of 93% from 2024 to 2029.

These data not only reflect the market’s positive expectations for Micro LED technology, but also outline its bright prospects for large-scale popularization in broad application fields such as large-screen displays. As the industrialization process continues to accelerate, Micro LED is leading display technology into a new era step by step.