In recent years, with the rapid development of technology and the promotion of multiple industrial chains, coupled with the country’s “5G+8K” strategy and the “Hundred Cities, Thousand Screens” plan, the development of the Mini/Micro LED display industry has entered a new era. At present, the core focus of the Mini LED production line is mainly on good product stability, ultra-high production yield and input-output ratio, and online quality early warning mechanism.
In response to these concerns, Zhuoxing Semiconductor has gone through years of in-depth research and highly integrated the process flow of Mini LED packaging processes such as printing, die bonding, welding, lighting + inspection and rework. Especially in the field of die bonding machine equipment, it has successively launched the first generation AS3603 pixel die bonding machine, the second generation AS3601 pixel die bonding machine, etc., and has gradually opened up the market and occupied a place in the industry with its advantages of fast die bonding speed, high precision, wide range, strong stability, and high substrate yield.
First generation: AS3603 pixel die attaching machine
Zhuoxing Semiconductor's AS3603 pixel die attaching machine adopts a double-arm six-ring method, which attracted the attention of the industry as soon as it was launched. The die-bonding speed reaches 40K/H, the die-bonding precision position error is <±15um, the angle error is <1°, and the die-bonding yield reaches 99.99%. All performances are at the leading level in the industry.
In order to meet the diverse and in-depth needs of customers, Zhuoxing Semiconductor has comprehensively upgraded its equipment in terms of structure and system. The motor parameters have been optimized at the structural level to make the swing arm lighter and the fixture more compatible. At the system level, the dragging and anti-collision functions have been optimized, and the chip polarity detection function has been added. The data table has been updated to ensure more accurate visual recognition, and the crystal finding algorithm has been further optimized to avoid limiting effects.
Second generation: AS3601 pixel die attaching machine
Zhuoxing Semiconductor has subverted the traditional die attaching model and developed a second generation pixel die attaching machine with a historic breakthrough - AS3601 pixel die attaching machine. Compared with traditional wafer die-bonding machines, Zhuoxing Semiconductor AS3601 pixel die-bonding machine has three arms and three rings, which can complete the die-bonding of one pixel (R, G, B) at a time, further optimizing the scheduling path and improving die-bonding efficiency and accuracy; it is also equipped with an automatic nozzle cleaning function.
In terms of die-bonding efficiency, traditional single-arm or double-arm die-bonding machines attach the "R" chip, "G" chip, and "B" chip in order. The disadvantage is that the die-bonding path is lengthened and the cost of the company is increased. Zhuoxing Semiconductor's pixel die-bonding machine optimizes the die-bonding path and can complete the photo-taking and positioning of three RGB chips at one time, simultaneously capture the "RGB" three-color chips, and alternate die-bonding to achieve the transfer and lamination of the three-color chips. This can reduce the moving distance of the three-arm die-bonding platform to less than 1/2 of the traditional die-bonding method, and increase the die-bonding efficiency by more than 30%.
In terms of crystal bonding accuracy, Zhuoxing Semiconductor's pixel crystal bonding machine simultaneously extracts/fixes crystals through RGB three-color chips. The crystal extraction/fixing parameters are more targeted and can improve equipment yield. The crystal extraction platform is equipped with an automatic wafer ring correction function, and the RGB wafer ring visual identification solutions are configured independently, making the identification more accurate. It also uses the original 3C die-bonding rules, namely Correction, Control and Continuity, to improve die-bonding accuracy and speed and ensure die-bonding yield.
In line layout and automated assembly lines, Zhuoxing Semiconductor's pixel bonding machines can be wired in parallel to achieve single-machine multi-loop and multi-machine joint mixed printing functions, using the most scientific scheduling path to eliminate equipment differences. The first-generation line is equipped with 24 AS3603 pixel die-bonding machines, with an hourly production capacity of 864k. The second-generation line is equipped with 24 AS3601 pixel die-bonding machines, and its production capacity has been greatly improved compared to the first generation. The production capacity reaches 1200K per hour, which greatly improves the die-bonding efficiency and ensures product quality.
It is worth mentioning that Zhuoxing Semiconductor's die-bonding equipment is equipped with an automatic early warning function. When a certain die-bonding equipment fails, the system will automatically turn on the early warning. Even if this equipment is down, it will not affect other running die bonding equipment, greatly improving the utilization rate of the entire production line.
The die-bonding machine is the core equipment of the entire Mini LED production line. After the first-generation AS3603 pixel die-bonding machine represented by Zhuoxing Semiconductor responded to market demand, it launched the second-generation pixel die-bonding machine AS3601. In the future, it will continue to increase investment in research and development and actively deploy the Mini LED and Micro LED markets, aiming to enhance product competitiveness and profitability.
To sum up, Zhuoxing Semiconductor provides users with this set of Mini The main advantages of LED direct display overall solution are:
①Self-test setting, batch die-bonding abnormality early warning;
②Achieve process control settings;
③Product quality abnormal traceability; Technology upgrades and market layout in the field of LED direct display, continuous introduction of highly competitive die-bonding equipment and integrated solutions, leading the domestic semiconductor industry to impact the international field.
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