The reporter learned from the Guangdong Semiconductor Lighting Industry Joint Innovation Center (GSC) on the 29th that the latest LED crystal expansion machine was successfully developed at the center. The crystal expansion machine can solve the problem of chip rotation and unequal distance between chips caused during the expansion process, and can improve the production efficiency of the LED packaging and solidification process.
LED crystal expansion machine is also called wafer expansion machine or chip expansion machine. It is used to produce LED light-emitting tubes, digital tubes, backlights, etc. to expand the distance between wafers. It is widely used in the grain expansion process in the production of light-emitting diodes, small and medium power transistors, backlights, LEDs, integrated circuits and some special semiconductor devices.
In the die-bonding process after the die is expanded, the suction nozzle of the die-bonding machine needs to pick up the chip and accurately place the chip in a determined position. When the position and angle of the chip deviate, the mechanical arm of the die-bonding machine needs time to adjust the angle and position before picking up each chip. Therefore, the shortcomings of the expansion method of this type of die-expanding machine affect the subsequent die-bonding process, thus reducing the efficiency of automated production.
On the other hand, in recent years, wafer-level packaging technology has become increasingly mature. The entire substrate of ceramic or other materials is prefabricated. The size and electrodes of the single-chip substrate correspond to the size and electrode position of each chip. There are several different forms of wafer-level packaging, one of which involves attaching all expanded chips to a single substrate at once. If the distance between the expanded chips is not equal and the chips are placed horizontally at different angles, this type of wafer-level packaging cannot be performed.
Therefore, how to solve the wafer-level packaging process problems to improve production efficiency has become an urgent problem in the LED packaging production process. The new LED crystal expansion machine successfully developed by the GSC Technical Standards R&D Department this time just solves this problem.
The inventor of this product, Ph.D. in Physics from the University of Alabama in the United States, has served as a Bridgelux product engineer in the United States, AXT equipment/packaging manager in the United States, and technical consultant of the GSC Technical Standards R&D Department. Dr. Peng Hui said: "This crystal expansion machine with independent intellectual property rights causes the blue film and the wafers on the blue film to expand along the two directions of the chip cutting lane when the film mechanism rises upward, instead of along the circumferential direction of the film mechanism. External expansion solves the problem of chip rotation and unequal distance between chips caused during the expansion process, which improves the production efficiency of the subsequent normal LED packaging die-bonding process. "
It is reported that this equipment also focuses on solving the first packaging process problem of wafer-level packaging, and will help improve the accuracy of the docking technology between the substrate and the chip in the wafer-level packaging. The successful development of this equipment will provide important technical support for LED packaging production.
ANNA