With the gradual development of the LED market, flip-chip LED products undoubtedly have a huge market space, and in the production process of these flip-chip products, the selection of flip-chip auxiliary materials is also crucial.
Solder paste accounts for a negligible cost in auxiliary materials, probably less than 1%. The process cost is currently the lowest on the market. It has successfully replaced the past die-bonding glue, but its share of the entire flip-chip market is still relatively low, mainly concentrated in the field of flip-chip COB.
In the LED packaging market, flip-chip will be a trend, but now the market share of flip-chip is indeed very low, and the problem faced is undoubtedly cost control.
It is true that the application of solder paste in flip-chip devices has attracted much attention from enterprises. For LED packaging products, packaging materials and packaging structures are the main factors affecting their performance.
The requirements for LED packaging devices in the future will gradually develop in the direction of high integration, cost reduction, and high reliability.
The application of flip-chip chips on the EMC bracket platform breaks the tradition, transforming the traditional formal wiring method into a flip-chip method without gold wires, and introducing a world-class fully automated production line, achieving the advantages of high product production efficiency, low device cost, high reliability, long service life, and easy application.
Due to the different die-bonding methods, products that use solder paste for die-bonding have more than 10 times the thermal path of traditional formal products, effectively solving the problem of light source heat conduction, making the product's thermal path smoother, and greatly extending its service life.
According to industry insiders, "The failure to open the market is not a problem with solder paste technology, but with the cost of flip-chip. The largest proportion of the cost may be flip-chip. For the current situation of LED, if the cost is too high, it will be difficult to replace the original process."
According to the survey, flip chip products currently on the market are mainly provided by New Century, Epistar, Guanghong, etc. in Taiwan. In addition, foreign manufacturers such as Europe, the United States, Japan and South Korea also ship small quantities. Domestic chip manufacturers including Dehao Runda and Huacan Optoelectronics have also begun to gradually increase the mass production of flip-chip chips in the past two years.
LED flip chip combines the advantages of formal chips and vertical chips, and has broad application prospects in general lighting, automobiles, high-power lighting, large-size backlights, projectors, flashes and other fields.
Because flip-chips have good heat dissipation, high reliability, and can withstand large current drives, they have a high cost performance and have become the mainstream development direction of the LED industry in the past two years.
From the current technology point of view, the light efficiency of flip chip is almost the same as that of formal chip, but the cost of flip chip is slightly higher. I believe that with the entry of flip chip manufacturers in large quantities, the price will inevitably drop significantly, and flip chip will gradually become like formal chip.
ANNA