Image source: AMEC
In terms of project progress, in July 2023, the 140,000-square-meter AMEC Nanchang production and R&D base was completed and put into use; currently, the AMEC Lingang Headquarters and R&D Building located on the bank of Dishui Lake is also under construction, and will cover an area of approximately 100,000 square meters after completion. In the future, the total area of China Micro's production and R&D base will reach approximately 450,000 square meters.
In terms of business progress, AMEC has made breakthroughs in the fields of etching equipment, thin film deposition equipment, MOCVD equipment and other fields. In the field of etching equipment, with the dual-machine technology of etching equipment, China Micron took the lead in proposing the concept of "picometer-level" processing accuracy. Its etching accuracy has reached a level below 100 "picometers", which is equivalent to an accuracy of one part in 3.5 million of a human hair, and can meet more than 90% of etching application requirements.
In the field of semiconductor thin film deposition equipment, China Microelectronics Corporation has launched Preforma Uniflex® CW, Preforma Uniflex® HW, Preforma Uniflex® AW and many other new products. In addition, its newly developed silicon and silicon germanium epitaxy EPI equipment, wafer edge Bevel etching equipment and other new products will also be put into market verification in the near future.
In the field of MOCVD equipment, AMEC has continuously enriched its product line and rapidly upgraded and iterated since the launch of the first-generation MOCVD equipment PRISMO A7®. Currently, AMEC has a leading market share in the field of gallium nitride-based equipment such as Mini LED, and continues to develop MOCVD equipment for the manufacturing of power devices such as gallium nitride and silicon carbide and Micro-LED devices.

ANNA