Nearly stringent quality requirements, especially in advanced packaging fields such as flip-chip COB and MIP-GOB, how to "efficiently" conquer the technical barriers of light mixing, light splitting, color separation, ink color sorting, as well as defect discovery and repair, to ensure uniform screen displaySexuality and consistency have become the key to industry development and quality growth. Colorlight's Mica production line automated correction solution, as well as advanced correction tools based on AI and artificial vision technology, are becoming the key engine to drive the "extreme" manufacturing upgrade of LED displays.
The pain of the extreme era: not only consistency, but also an efficiency challenge
In the past 3 years, COB (Chip on Board) packaging technology has quickly become the mainstream choice for fine-pitch LED displays (especially dot pitches P1.2 and below) with its advantages such as high reliability, seamless splicing, and excellent protection. The market growth has continued to double. However, panel-based packaging such as COB or GOB, while having experience advantages, also faces significant challenges:
For example, ink color consistency, light mixing and spectroscopic color separation problems&- A large number of chips are densely arranged, and their inherent small differences in brightness (Lv) and chromaticity (x, y) will be significantly amplified when viewed at close range. Micro-pitch LED products are increasingly being used at closer viewing distances. The dot spacing becomes smaller, the clarity is enhanced, and the viewing distance is closer, making it easier for the naked eye to detect display defects. At the same time, ultra-high-definition content such as 4K has higher requirements for display quality, and virtual simulations or high-end conferences have higher requirements for picture perfection—traditional random inspection or manual visual sorting methods can no longer meet market demand.
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