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Huawei Technologies Co., Ltd. obtains patents for LED chip packaging modules, display screens and manufacturing methods

On April 22, according to information from the State Intellectual Property Office, Huawei Technology Co., Ltd. obtained a patent entitled "led chip packaging module, display screen and its manufacturing method". The authorization notice number is CN111933630B, and the application date is July 2020.

According to Tianyan, Huawei Technology Co., Ltd., founded in 1987 and located in Shenzhen, is a company mainly engaged in the manufacturing of computers, communications and other electronic equipment. The registered capital of the enterprise is 40941131.82 ten thousand yuan. Through the big data analysis of Tianyan, Huawei Technology Co., Ltd. has invested a total of 50 companies abroad, participated in bidding projects 5,000 times, had 5,000 trademark information and 5,000 patent information in terms of property leads, and also has 1,534 administrative licenses.

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