The patent summary shows that this application relates to an LED substrate and a display module. The LED substrate includes: a glass carrier plate, the first surface of the glass carrier plate is provided with a conductive circuit; an HDI circuit board, the HDI circuit board is fixed on the second surface of the glass carrier plate, and the HDI circuit board is electrically connected to the conductive circuit on the glass carrier board. The first board surface and the second board surface are respectively located on opposite sides of the glass carrier plate. In this application, a glass carrier board is provided on the HDI circuit board, and conductive lines are arranged on the glass carrier board. The surface accuracy and flatness of the glass carrier board are much greater than those of the HDI circuit board, which is beneficial to the fixed placement of the chip and can be applied to Micro LED display solves the technical problem in related technologies that the substrate made of HDI multi-layer circuit board is difficult to apply in Micro LED display.
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