Phoenix's current engineering sample features a 0.22-inch panel with 2K resolution and 5.2um sub-pixel pitch. A 2X2 subpixel array combines into a 5um pitch white pixel with 4 independent current drive channels. Three of the channels are connected to the AlInGaN blue emitter, the AlInGaN green emitter, and the AlInGaP red emitter. Most importantly, these semiconductor emitters are stacked vertically and arranged coaxially, as shown in the cross-sectional SEM image in Figure 1 . This unique emitter arrangement allows for high WPE and high light concentration in the vertical direction. In future production phases, JBD plans to make 0.3-inch panels as standard, with 4K resolution and 2um sub-pixel pitch, equivalent to 2K resolution, with a 4um white pixel pitch.
Figure 1: (a) Full color wafer; (b) 45 degree tilt SEM image of 5um color pixel pitch array; (c) Focused ion beam cut and cross-section SEM image of multi-level interconnect technology, electrical connection schedule not shown
To date, color conversion using quantum dots (QDs) remains the most common method for achieving monolithic RGB displays. This down-conversion approach is currently limited in the maximum brightness and device lifetime that can be achieved, as QD lifetime decreases significantly with increasing pump flux density and MicroLED junction temperature. Other epitaxy-based three-color integration technologies, such as multicolor epilayers, selective area epitaxy, regeneration, nanostructures, and 3D structures, have yet to produce better prototypes at pixel pitches less than 10um.
Existing full-color MicroLED displays are achieved by combining three separate red, green and blue panels with X-cube prisms. Single-panel monolithic RGB microdisplays are ultimately preferred because they enable a larger field of view and a smaller light engine form factor. Furthermore, higher waveguide collimation efficiency can be achieved due to reduced optical losses due to simplified system-level integration onto AR glasses. However, MicroLED-based ultra-fine pitch (
Leveraging its expertise in wafer-level bonding and thin epitaxy technologies, JBD has successfully developed full-color displays using its proprietary multi-layer interconnect technology. Native nitride and phosphide epitaxy and chip processes such as Mesa etch, passivation and microlensing, based on JBD’s award-winning “SID Display of the Year 2023” monochrome panel, now in volume production, ensures that its manufacturability, high socket efficiency, reliability and narrow beam collimation are maintained. A key feature of the technology is the overall stack thickness of less than 5um, which is the thinnest ever, minimizing absorption losses within the cavity. Combined with the ability to operate native color light sources at high flux densities, white flat surfaces up to 1 million nits can be achieved using this platform. Brightness. Another notable feature of the fully native color solution is the ability to achieve high color quality and color purity in the full width half maximum (FWHM) spectrum. Figure 2 shows the 15nm, 30nm and 18nm FWHM values achieved for red, green and blue pixels respectively.
JBD founder and CEO Qiming Li said: "We have achieved this engineering feat thanks to the hard work of JBD scientists and engineers. The Polychrome platform delivers game-changing innovative solutions and opens the door to immersive AR glasses. The future of AR glasses becoming the next computing platform has never been brighter, and we are excited to embark on this journey with our customers."
JBD will demonstrate a prototype of a native color monolithic multicolor projector in the first half of 2024. The panels are scheduled to go into mass production in 2025.
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