Kage Precision Machinery stated that the company continued its growth trend in the first quarter of 2025, achieving operating income of 196.5583 million yuan, a year-on-year increase of 27.23%; the net profit attributable to shareholders of the parent company was 33.2097 million yuan, a year-on-year increase 208.34%; net profit excluding non-recurring gains and losses was 31.4635 million yuan, a year-on-year increase of 235.72%. Net profit excluding non-recurring gains and losses has increased quarter-on-quarter for four consecutive quarters, showing steady development momentum. The reason for the revenue growth in the first quarter of 2025 is mainly due to the rebound in downstream consumer electronics demand represented by mobile phones, the growth in demand for AI servers, and the increase in the penetration rate of new energy vehicles, which have brought about the growth in demand for electronic assembly equipment. Net profit grew rapidly year-on-year and month-on-month, mainly due to the increase in gross profit margin. On the one hand, the proportion of high-end products in some business revenue continues to increase., pushing up the gross profit margin of this business; on the other hand, the proportion of high gross profit margin business revenue structure has further increased.
In the future, Kaige Precision Machinery will continue to consolidate its market leadership position as the single champion solder paste printing equipment, continue to improve its products, promote product iterative upgrades, and continue to maintain its competitive advantages in product quality, process solutions and technical support. As COB and MiP technologies continue to mature, the proportion of market demand continues to increase. The company gives full play to the equipment efficiency and stability advantages of die-bonding machines in the trend of chip miniaturization, intensifies efforts to expand the Mini/Micro LED die-bonding machine business, and increases market share. Increase investment in resources applied to pan-semiconductors and semiconductor products, improve new product development capabilities and channel expansion capabilities, and increase efforts to increase the market share of existing products.
The company's R&D investment in operating revenue in 2024 and the first quarter of 2025 will account for 9.12% and 9.88% respectively. In 2024, the R&D center carried out a number of technological innovations and applications, such as incorporating AIThe visual model is applied to chip detection and defect detection in packaging equipment, glue point detection of glue dispensing machines, and defect detection of ball planting machines; a Turing-complete low-code vision platform has been developed to quickly respond to changing visual needs, and has been applied in many new projects; 3D Vision is applied to the glue path guidance and detection links of the five-axis dispensing machine, which improves the accuracy, stability and detection efficiency of dispensing; the electrical engineering field has upgraded the electrical integration development method, and developed unique control drive products that can be embedded into mechanical modules; developed and reserved the entire line technology of "printing + ball planting + detection + ball filling" in the advanced packaging field.
The company’s overseas market expansion strategy is a multi-faceted and multi-level international layout, aiming to achieve sustained growth in the global market and increase brand influence by following existing customers, deepening the local operations of overseas subsidiaries, responding flexibly to market changes, and actively participating in international exchanges. GKGASIA, a holding subsidiary, has profound accumulation in the field of electronic manufacturing. By establishing service networks in key markets such as Vietnam, Mexico, India and Malaysia, we are able to provide more localized service and support. In addition, by recruiting local employees and expanding distribution channels, we are able to better understand local market needs, build brand influence, and increase market penetration.It is understood that the main products of Kaige Precision Machinery are solder paste printing equipment, dispensing equipment, packaging equipment and sexual automation equipment. The company's solder paste printing equipment is mainly used in the printing process of SMT (electronic assembly) and COB processes. By printing solder paste onto the PCB/substrate, the fixed bonding and electrical signal connection of the electronic components/bare chip and the PCB bare board/substrate are achieved. It is a core link in the SMT and COB processes. Currently, there are GLED-mini III that meets the high-precision printing and mass transfer requirements of the Mini LED/Micro LED technology route, and Mini LED that meets the glass-based printing process without a carrier. The COG route shows demand for X6 and other products. Packaging equipment is mainly used in the packaging process of the electronics industry manufacturing field and the die-bonding process of the semiconductor packaging process. It can be used in LED lighting and display devices, and the semiconductor chip packaging process. Currently, there are GDM series die-bonding equipment suitable for Mini LED direct display, Mini LED backlight, COB, COG (glass-based), MIP all-in-one and other product applications. The GD80 series die-solid equipment is suitable for the chip die-bonding process of LED lighting, LED displays and other devices. The company has registered the trademark "GKG" in more than 70 countries and regions around the world, and its products are sold to more than 50 countries and regions around the world.
ANNA