The specific content is as follows:
Q: The company has a rich product line, what are its main products?
Answer: The company is mainly engaged in the research and development, production, sales and service of new semiconductor display intelligent equipment, automobile intelligent cockpit system equipment, semiconductor packaging and testing equipment, and new energy equipment. The company's main products include binding equipment, laminating equipment, offset equipment, testing equipment, large-size TV complete line equipment, mobile terminal automation equipment, automotive smart cockpit system assembly equipment, Mini/Micro LED chip sorting equipment, crystal expansion equipment, vacuum laminating equipment, mass transfer equipment, semiconductor flip-chip equipment, die-bonding equipment, OI testing equipment, lead frame laminating equipment, lithium battery die-cutting and lamination equipment, battery cell assembly section and pack section complete line automation equipment.
Q: What equipment does the company provide for customers who produce folding screens?
Answer: The company provides discounts for productionCustomers of stacked screens provide screen production and manufacturing equipment, mainly including binding equipment, laminating equipment, laminating equipment, testing equipment and assembly equipment. The company is a technological leader in binding technology and lamination technology for folding screens.
Q: What equipment has the company launched in the field of Mini/Micro LED display?
Answer: The company currently has launched chip sorting equipment, chip expansion equipment, testing equipment, vacuum laminating equipment, chip mass transfer equipment, high-precision splicing equipment, etc. in the field of Mini/Micro LED display.
Q: What products does the subsidiary Shenzhen Liande Semiconductor Technology Co., Ltd. mainly sell?
Answer: In the semiconductor field, the company mainly produces packaging and testing equipment for the semiconductor back-end process. The main products are COF flip-chip machines, semiconductor flip-chip machines, soft solder die-bonding machines, eutectic die-bonding machines, OI inspection machines, lead frame laminating machines and other high-speed and high-precision semiconductor equipment. At present, eutectic, soft solder and other die-bonding machines and equipment such as QFN lead frame lamination and lead frame inspection have been delivered to customers for mass production. The company will pay close attention to the development trends of the industry and the development trends of cutting-edge technologies, and actively create and seize development opportunities in the field of semiconductor equipment.
Q: What is the company’s overseas equipment market expansion status?what?
Answer: In overseas markets, the company has accumulated customer resources from many Fortune 500 companies such as Continental Automotive Electronics, Bosch, and Visteon, and has established good cooperative relationships. The company's layout in this industry has gradually been realized in orders. In particular, the company's in-depth cooperation with major foreign customers has enabled the equipment to be deployed in Europe, Southeast Asia, and North America.
Q: How will the company continue to expand sales channels in the future?
Answer: The company continues to promote the layout of global business, and actively explores overseas sales markets on the premise of stabilizing its leading edge and market share in the domestic market. With its excellent equipment performance, advanced technical level, exquisite process design, strong delivery control capabilities and perfect after-sales service system, the company has been widely recognized by major overseas customers and has reached in-depth cooperation. In the future, the company will continue to explore overseas sales markets, further expand sales channels, continue to promote the company's business development, and report to investors with good operating performance.
Q: What is the company’s future development strategy?
Answer: The company will continue to strengthen research and development in the fields of semiconductor display module equipment, automotive intelligent cockpit system equipment, semiconductor packaging and testing equipment and new energy equipment. Actively develop flexible display module equipment and display front-end process laminating equipment, Mini/Micro LED equipment, VR/R/MR precision assembly equipment, automotive smart cockpit system equipment, semiconductor packaging and testing equipment and new energy equipment are used in the application market in emerging fields. At the same time, we will continue to increase the research and development of new technologies and new products in these fields to support the rapid growth of this business. The company will enrich product categories, improve product systems through multi-dimensional product layout, and incubate R&D technical team models through internal extension development to form a stable and sustainable development platform.
Main business of Liande Equipment (300545): Mainly engaged in the research and development, production, sales and service of semiconductor display intelligent equipment, automobile intelligent cockpit system equipment, semiconductor packaging and testing equipment, and lithium battery equipment.
Liande Equipment’s first quarter report for 2024 shows that the company’s main operating income was 349 million yuan, a year-on-year increase of 30.61%; net profit attributable to the parent company was 45.7334 million yuan, a year-on-year increase of 11.25%; non-net profit after deducting 44.9826 million yuan, a year-on-year increase of 12.04%; debt ratio 45.27%, investment income 0.0 Ten thousand yuan, financial expenses were 1.9893 million yuan, and the gross profit rate was 31.76%.
ANNA