The patent abstract shows that the present invention discloses a manufacturing method of an LED device, an LED device and an LED module. The manufacturing method of the LED device includes: laminating the bottom copper foil on a temporary carrier board, and etching the bottom copper foil to form bottom lines and connecting copper pillars; solidifying a driver IC chip on the bottom line, and placing a driver IC chip on the electrode of the driver IC chip. Form an electroplating layer; encapsulate the driver IC chip to form a first package; press the top copper foil on the first package to connect the top copper foil to the electroplating layer; etching the top copper foil to form a top line; solidify and encapsulate the LED chip on the top line to form a second package; peel off the temporary carrier to form an LED device. The invention has a simple manufacturing process, effectively reduces the manufacturing cost of the LED display device, improves the reliability and display effect of the device, and improves the production efficiency of the device.

ANNA