Unilumin Technology obtains patents for LED modules and LED displays, achieving joint sealing

The patent summary shows that this application involves an LED module and an LED display. The LED module includes a panel, a PCB substrate and an LED light-emitting chip arranged on the PCB substrate. The side of the PCB substrate with the LED light-emitting chip serves as a display surface, and the panel is covered on the display surface; the PCB substrate has a groove on the display surface, and the groove surrounds all the LEDs. The light-emitting chip is used to form a closed surface that is different from the display surface; the panel has an embedded portion protruding from the side facing the display surface, and the embedded portion is adapted to the groove so that the panel can be installed on the PCB substrate. The above-mentioned LED module changes the position of the bonding seam between the LED panel sealant material and the PCB substrate through the design of the groove bonding embedded part, thereby sealing the bonding seam and protecting the PCB substrate exposed by the bonding seam, thereby preventing water vapor from contacting the LED light-emitting chips and lines on the PCB substrate through the bonding gap.Roads and other components can be applied to the design of outdoor waterproof modules using the general outdoor COB process.