Rayleigh Vision Intelligence (RVI) released the world's first AI-driven Micro LED smart manufacturing technology "AI MioC" at Nvidia's GPU Technology Conference (GTC 2025), which can improve production efficiency and reduce production costs, breaking through the mass production bottleneck of the Micro LED industry. In addition, the Micro LED array produced by this technology can also provide a more efficient and economical light source solution for the next generation of silicon photonic communications, demonstrating the high-speed iterative forward cycle brought about by "making AI with AI".
Rayleigh Optical Intelligence is a Taiwanese startup company focusing on AI intelligent manufacturing and silicon photonics technology. At the GTC 2025 conference, NVIDIA CEO Jensen Huang officially announced the launch of the Spectrum-X photon co-packaged optical network switch, which supports the expansion of AI factory scale to one million GPUs, increases energy efficiency by 3.5 times, and improves reliability by 10 times. NVIDIA has joined hands with many industry leading companies to jointly promote AI technology innovation. This product uses TSMC’s latest CPO (Co-Packaged Optics) technology.
The AI MioC technology released this time uses advanced artificial intelligence algorithms to optimize the Micro LED manufacturing process.The process not only improves production efficiency, but also reduces production costs and breaks through the mass production bottleneck of the Micro LED industry. In addition, the Micro LED array produced by this technology can also provide a more efficient and economical light source solution for the next generation of silicon photonic communications.
The founders of Rayleigh Optical Intelligence, Professor He Zhihao and Dr. He Zhixiang, brothers, returned to Taiwan to start a business together, combining their rich experience in the silicon photonics and semiconductor industries to promote this breakthrough technology. Dr. He Zhixiang said that at GTC 2025, Huang Renxun’s speech officially announced that under the wave of AI chips, computing power optimization must rely on silicon photons, and requires comprehensive integration of optical communications at the chip and motherboard levels (chip-to-chip and board-to-board). Micro LED silicon photonics technology will simultaneously improve the integration, computing power, heat dissipation performance and reliability of future CPOs. (Source: Times Information)
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