Sapien wins 4 billion won contract to supply MicroLED driver chips for AR

Sapien Semiconductor Micro LED driver chip

Sapien Semiconductor will be responsible for developing the complementary metal oxide semiconductor (CMOS) backplane according to the contract and mass production in the second half of next year.

CMOS backplane is a key component for controlling display pixels, usually called a display driver chip (DDI).

The company plans to apply CMOS backplane to the LEDoS engine that forms Micro LED on silicon substrate.

Sapien chips will be used in advanced augmented reality (AR) smart glasses that enhance artificial intelligence (AI) capabilities. It is used in advanced AR smart glasses games, health care, education, military and other professional industrial fields.

Sapien Semiconductor signed a 4.4 billion won (approximately 23.06 million yuan) CMOS backplane supply contract for basic AR smart glasses in June last year.

Sapien Semiconductor representative Lee Myung-hee said: "We not only supply basic products based on LEDoS, but also supply high-end Micro LED display solutions." He said: "The company will occupy the global smart glasses market in the future with its LEDoS technical strength that can maximize AI functions, rather than pure AR smart glasses."