The patent summary shows that the present invention discloses a MicroLED chip and a preparation method thereof. The MicroLED chip includes a first luminescent layer, a second luminescent layer, a third luminescent layer and a substrate that are stacked sequentially along the light emitting direction, and an adhesive layer that bonds each layer. The adhesive layer includes a plurality of light-transmitting holes, and the light-transmitting holes are aligned with the light-emitting direction of the light-emitting unit chip of the light-emitting layer. The vertically stacked MicroLED chip reduces the area of light passing through organic matter through the design of light-transmitting holes, avoiding the uncertainty of light transmittance caused by the instability of organic materials and the problems of light color changes caused by organic materials. This significantly improves the light transmission efficiency and the luminous efficiency of the LED chip, reduces light loss, and on the other hand improves the light mixing effect and maintains the consistency of the display color of the entire panel. Therefore, this MicroLED significantly improves the display effect and enhances the display brightness while being smaller in size.and color purity, with high practical value and market prospects.
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