On March 19, BOE Huacan held a Micro factory product delivery ceremony and comprehensively demonstrated the latest Micro LED solutions, ecological construction and production capacity strategic layout.
1) BOE Huacan announced the full delivery of Micro LED mass production products, which symbolizes its key milestone in completing Micro LED chips from research and development, trial mass production, stable mass production to commercialization. 2) BOE Huacan simultaneously announced the production capacity plan for Micro LED products. It is expected to achieve a Micro LED wafer (COW) production capacity of 1,000 sets (RGB)/month in 2025 and a Micro LED pixel device (MPD) production capacity of 2,500kk units/month. It can be used in large-size commercial displays, AR/VR head-mounted display devices, ADB car lights, wearable devices and other application fields, which will further promote Micro The large-scale application of LED technology helps the industry develop rapidly. At the same time, BOE Huacan said that in the future, according to changes in market demand, a second phase of production expansion may be carried out, and the production capacity can be doubled. 3) BOE Huacan releasedCOW/COC new product 1530@6inch, MPD new product 0303 & 0202, and related process flows were demonstrated on site, reflecting BOE Huacan's technology accumulation in Micro LED. 4) BOE Huacan displayed a variety of Micro LED products including large-screen displays, vehicle-mounted displays, AR micro-displays, etc., demonstrating BOE Huacan's layout in Micro LED.
According to on-site introduction, BOE Huacan's world's first large-scale mass production 6-inch Micro LED production line project has a planned area of 500 acres. The currently completed base is the first phase project, covering an area of about 217 acres, with an investment amount of approximately 2.3 billion. The main products are Micro LED wafers/pixel devices; the second phase project covers an area of approximately 120 acres, mainly producing Mini/Micro display products, and providing overall solutions to customers. In the future, with the completion of both phases of the project, the production of Micro LED wafers will be 24,000 pieces/year (6 inches), and Micro LED pixel devices 45,000kk/year, which means the total production capacity of 6-inch wafers will be about 30,000 pieces/month’s production capacity. This project has created a Micro LED wafer and pixel device production line, which can provide high-quality Micro LED products for customers with different application needs, achieve higher production yields under better luminous efficiency and wavelength consistency, initially realize the industrialization of Micro LED, and gradually improve the company's Micro LED ecological chain layout. It will rely on its existing epitaxy and chip advantages to tackle key technologies and become an application-side supplier of chips, pixel devices, small-size screens, modules, etc. As a Micro LED chip supplier, it will be delivered by Chip on wafer/Chip on carrier, etc.; it is targeted at application-end leading companies such as LG, Huawei, Konka, Chenxian, and BOE. In the role of pixel device supplier, it is delivered in bin form, and subsequent customers use the die-bonding method, targeting module factories such as Jingxin, Xida, and Unilumin. As a small screen supplier, it is delivered in the form of small-size screens as display modules for terminal products, targeting AR and VR glasses brands/OEMs, HUD manufacturers, and smart watch brands/OEMs. According to previous announcements, after the Zhuhai Micro LED project reaches production, BOE Huacan's Micro LED chip products (including Micro LED wafers and Micro LED pixel devices) are expected to increase operating revenue by 1.078 billion yuan. ■ New Product ReleaseAccording to on-site introduction, BOE Huacan’s new COW/COC product 1530@6inch, with a wafer size of 6 inches and a chip size of 15±1.5μm x 30±1.5μm, achieves a high yield of 99.99%, high luminous efficiency with diversification, improved brightness, and good epitaxial uniformity.
MPD new products 0303 & 0202, of which the 0303 device size is 300 x 300μm and the pad size is 75 x 85μm; the 0202 device size is 220 x225μm and the pad size is 60 x 58μm; both new products have a three-in-one structure to achieve high-efficiency die bonding, large pads, die die pass rate >80%, 6 times the pad area, 7 times the thrust strength, and achieve high welding strength. According to BOE Huacan, MPD (Micro Pixel Device) is a new generation of display technology platform that can achieve ultra-high black area ratio, optimal white flat viewing angle, increase die-bonding efficiency by 2/3, and can be applied to micro-pitch scenes. Product display At the scene, BOE Huacan displayed Micro LED 0.12-inch display, ultra-bright glass-based Micro LED HUD, AR glasses, 162-inch Micro displaydisplay screenand many other Micro LED products. The Micro LED 0.12-inch display is a monochrome display product suitable for high PPI displays, wearable devices, and AR glasses. Its light-emitting area size is 2.43mm*1.8mm, the resolution is 640*480, the pixel size is 3.75μm, and the number of particles is 307200. The number of screens produced using a 6-inch wafer is 916, and the brightness is >1000000nits.
The ultra-bright glass-based Micro LED HUD is a product for various vehicle-mounted and airborne head-up display applications. The single screen size is 3.8 inches, the brightness is 150,000nits, the contrast ratio is 3 million:1, and the pixel density is 431. It has the advantages of ultra-high brightness, ultra-high contrast, and ultra-high pixel density.
BOE Huacan also highlighted a 162-inch Micro display large screen with a resolution of 3840*2160, a chip size of 60*80μm, a brightness of 800nits, and a contrast ratio of 100000:1. It uses massive transfer + RDL technology and is mainly used in P1.2-0.6. The ultimate specification can be reduced to 0.4-0.3.

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